Specifications | ||
Inspection Capability | Wafer thickness range: | 400 μm ~ 2000 μm |
Detection resolution | 0.028 μm | |
Accuracy | ±0.2 μm | |
Repeatability | 3σ≦1.0 μm | |
Accuracy (benchmarking FRT) | THK/Bow/Warp ≥95% | |
Accuracy (benchmarking FRT) | TTV/TIR linearity ≥ 90% | |
Main Power | AC220V, 10A, 50Hz, 2.0kW | |
Vacuum | -70kpa~-50kpa, Ø6mm PVC | |
Compressed air | 0.6MPa ( Oil less ) | |
Environment | clean rooms above 1000 | |
Dimension ( L x W x H ) | 1850 x 1380 x 2250 mm | |
Weight | 1,200kg |