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Wafer Surface Profile Inspection and Sorting

4inch, 6inch, 8 inch Silicon Wafer , Sapphire Wafer , SiC wafer

INQUIRY

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Specifications

Inspection Capability

Wafer thickness range:

 400 μm ~ 2000 μm

Detection resolution

0.028 μm

 Accuracy

±0.2 μm

Repeatability

3σ≦1.0 μm

Accuracy (benchmarking FRT)

THK/Bow/Warp ≥95%

Accuracy (benchmarking FRT)

TTV/TIR linearity ≥ 90%


Main Power

AC220V, 10A, 50Hz, 2.0kW

Vacuum

-70kpa~-50kpa,   Ø6mm  PVC

Compressed   air

0.6MPa   ( Oil less )

Environment

 clean rooms above 1000

Dimension ( L x W x H )

1850 x 1380 x 2250 mm

 Weight

1,200kg