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MET-4000A Wafer Edge Grinder System
No contact automatic positioning, Laser mode
Flat & notch type
Highly accurate grinding by synhronized X∙Y∙θ support control
Easy operation by touch panel
Measuring of grinding result and automatic correction
Grinding Table X, Y, Z-axis
Grinding Table θ -axis 0.001°
Driving system AC servo Motor etc
Transfer unit chuck loading(upper surface)
Cleaning unit, spin cleaning,
Loading unit, cassette carrirt type, 4 cassettes
Specifications | |
Wafer size | 4 ~8 inch |
Wafer Thickness | 0.3mm~1.0mm |
Wafer type | (R type /T type ) OF, CF, Notch |
Spindel frequency(Ø202) | 200~3000rpm |
Periphery Grinding Wheel | OD Ø202 mm ID Ø30 mm |
Grinding X/Y/Z accuracy | 2 μm |
Roundness accuracy | ±10 μm |
Chamfer face width | ±10 μm |
Thickness measurement | ±2 μｍ |
Notch depth accuracy | ±5μm |
Dimension ( L x W x H ) | 2400 x 1680 x 1995 mm |
Main Power | 220V 3phase 15A |
Compressed Air | 5kg／c㎡, 200L/min(max) |
