BSC-GO-4-78K

Because when testing wafers in low-temperature atmospheric environments, water vapor in the air will condense on the wafers, causing excessive leakage or the probe being unable to contact the electrodes, resulting in test failure. To avoid these situations, it is necessary to pump out the water vapor in the vacuum chamber before testing and keep the pump running throughout the entire testing process.
When the wafer is heated to temperatures of 300 ℃, 400 ℃, 500 ℃, or even higher, the oxidation phenomenon becomes more and more obvious, and the oxidation becomes more severe as the temperature increases. Excessive oxidation can lead to electrical errors, physical and mechanical deformation of wafers. To avoid these situations, the oxygen in the vacuum chamber needs to be pumped out before testing, and the pump should be kept running throughout the entire testing process.
During wafer testing, the temperature changes between low temperature and high temperature. Due to thermal expansion, there will be relative displacement between the positioned probe and the device electrode. At this time, it is necessary to reposition the needle seat, which is located outside the cavity. We can also choose to use an automated needle holder controlled by a joystick to adjust the position of the probe.