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In-line Inspection & Sorting System
In-line Inspection & Sorting System
*After
TTV, BOW, WARP, SORI measure, sort automatically.
*Supports
plus, minus direction error for BOW measurement
*Automatic
Laser ID marking with various clients.
*Measure
the wafer tilt and correct to mark the wafer ID
*Automatic
Barcode marking system
*Support the distinction of wafer’s top and bottom after process(Base on CMP and Lapping Process -Top : CMP process, Bottom : Lapping
